XC7Z100-2FFG1156IXilinx
XC7Z100-2FFG1156I is an AMD/Xilinx Zynq-7000 All Programmable System-on-Chip (SoC). It features a dual-core ARM Cortex-A9 processing system paired with 28nm programmable FPGA logic (444K logic cells) in an 1156-pin Fine-Pitch Ball Grid Array (FBGA) package with an industrial temperature grade.
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Xilinx XC7Z100-2FFG1156I technical specifications, attributes, parameters and parts with similar specifications to Xilinx XC7Z100-2FFG1156I.
Type
Parameter
Series
Zynq®-7000
Packaging
Tray
Part Status
Active
Manufacturer Lead Time
16 Weeks
Architecture
MCU, FPGA
Connectivity
CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Core Processor
Dual ARM® Cortex®-A9 MPCore™ with CoreSight™
Operating Temperature
-40°C ~ 100°C (TJ)
Package / Case
1156-BBGA, FCBGA
Peripherals
DMA
Primary Attributes
Kintex™-7 FPGA, 444K Logic Cells
RAM Size
256KB
Speed
800MHz
Supplier Device Package
1156-FCBGA (35x35)
ExportControlClassNumber
3A991D
HtsusCode
8542.39.0060
MoistureSensitivityLevel
4 (72 Hours)
ReachStatus
REACH Unaffected
RohsStatus
ROHS3 Compliant
Manufacturer:
AMD
Product Category:
SoC FPGA
Mounting Style:
SMD/SMT
Package / Case:
FCBGA-1156
Core:
ARM Cortex A9
Number of Cores:
2 Core
Maximum Clock Frequency:
766 MHz
L1 Cache Instruction Memory:
2 x 32 kB
L1 Cache Data Memory:
2 x 32 kB
Number of Logic Elements:
444000 LE
Adaptive Logic Modules - ALMs:
69350 ALM
Embedded Memory:
26.5 Mbit
Number of I/Os:
400 I/O
Minimum Operating Temperature:
- 40 C
Maximum Operating Temperature:
+ 100 C
Brand:
AMD / Xilinx
Moisture Sensitive:
Yes
Number of Logic Array Blocks - LABs:
34675 LAB
Product Type:
Processors - Application Specialized
Series:
XC7Z100
Subcategory:
SOC - Systems on a Chip
Tradename:
Zynq
Download datasheets and manufacturer documentation for Xilinx XC7Z100-2FFG1156I.
Datasheet:
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