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    1. Home/
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    3. Memory ICs/
    4. Memory Controllers/
    5. KLM8G1GEUF-B04Q057 SAMSUNG
    KLM8G1GEUF-B04Q057
    KLM8G1GEUF-B04Q057
    KLM8G1GEUF-B04Q057

    KLM8G1GEUF-B04Q057SAMSUNG

    Samsung KLM8G1GEUF-B04Q057 8GB eMMC 5.1 HS400 Embedded NAND Flash Memory Samsung KLM8G1GEUF-B04Q057 is an 8GB eMMC 5.1 embedded flash memory device featuring integrated NAND flash and controller technology, HS400 high-speed interface support, and a compact 11.5 mm × 13 mm BGA package. Designed for embedded Linux systems, industrial controllers, automotive electronics, smart devices, and IoT applications, this Samsung eMMC provides reliable storage performance with simplified system integration.

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    Part No:KLM8G1GEUF-B04Q057
    Manufacturer:SAMSUNG
    Package:-

    In Stock :Available

    Price not displayed? Please respond immediately.

    SAMSUNG KLM8G1GEUF-B04Q057 technical specifications, attributes, parameters and parts with similar specifications to SAMSUNG KLM8G1GEUF-B04Q057.

    Type
    Parameter
    Density
    64Gb
    Interface
    MMC/eMMC
    Manufacturer
    Samsung Semiconductor Inc.
    Part Number
    KLM8G1GEUF-B04Q057
    Product Category
    eMMC Embedded Flash Memory
    Memory Type
    NAND Flash + eMMC Controller
    Interface Standard
    eMMC 5.1
    Capacity
    8GB
    NAND Type
    MLC NAND Flash
    Interface Speed
    HS400
    Bus Width
    x8
    Operating Voltage
    1.8V / 3.3V
    Package
    FBGA
    Package Size
    11.5 mm × 13 mm
    Thickness
    Approx. 0.8 mm
    Operating Temperature
    Commercial / Industrial variants available
    Mounting Type
    Surface Mount
    RoHS
    Compliant

    Download datasheets and manufacturer documentation for SAMSUNG KLM8G1GEUF-B04Q057.

    Datasheet:

    PDF
    b44a04bb-82b2-4b8d-97ec-1bafe81e1348.pdf

    Shipping

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    Deliver Time

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    Package

    Step1: Prepare product
    Step1: Prepare product
    Step2: Desiccant Protection
    Step2: Desiccant Protection
    Step3: Vacuum Packaging
    Step3: Vacuum Packaging
    Step4: Individual Package
    Step4: Individual Package
    Step5: Anti-collision Filling
    Step5: Anti-collision Filling
    Step6: Packaging Box
    Step6: Packaging Box

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