K4FBE3D4HM-THCLSAMSUNG
K4FBE3D4HM-THCL is a 32Gb LPDDR4 SDRAM memory device manufactured by Samsung. Featuring a 2-channel x16 architecture, 4266Mbps data rate, 200-ball FBGA package, and -40°C to +105°C extended temperature operation, it is designed for automotive infotainment systems, ADAS modules, embedded computing platforms, AI vision devices, industrial terminals, and smart mobile electronics. The K4FBE3D4HM-THCL delivers high memory bandwidth, low power consumption, compact integration, and reliable performance for modern automotive and embedded applications.
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SAMSUNG K4FBE3D4HM-THCL technical specifications, attributes, parameters and parts with similar specifications to SAMSUNG K4FBE3D4HM-THCL.
Type
Parameter
Parameter
Specification
Manufacturer
Samsung
Part Number
K4FBE3D4HM-THCL
Memory Type
LPDDR4 SDRAM
Density
32Gb
Organization
2-channel, x16 per channel
Total Bus Width
x32
Max Data Rate
4266Mbps
Package
200-ball FBGA
Package Size
10mm × 15mm
Interface
LVSTL_11
Operating Temperature
-40°C to +105°C
Target Grade
Automotive / Extended Temperature
Download datasheets and manufacturer documentation for SAMSUNG K4FBE3D4HM-THCL.
Datasheet:
Shipping
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Shipping Method
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Deliver Time
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Package
PURCHASE
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MEANS OF PAYMENT
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IMPORTANT NOTICE
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