K4FBE3D4HB-KFCLSAMSUNG
W25Q16JVSSIQ is a Winbond 16Mbit / 2MB Serial NOR Flash memory from the W25Q16JV SpiFlash® family. It supports Standard SPI, Dual SPI, and Quad SPI interfaces with up to 133MHz clock frequency, operates from 2.7V to 3.6V, and comes in an 8-pin SOIC package. It is well suited for MCU firmware storage, BIOS and boot code, embedded systems, IoT modules, networking devices, industrial control boards, consumer electronics, and configuration memory applications.
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SAMSUNG K4FBE3D4HB-KFCL technical specifications, attributes, parameters and parts with similar specifications to SAMSUNG K4FBE3D4HB-KFCL.
Type
Parameter
Density
32 Gb
Package
200 FBGA
Speed
4266 Mbps
Voltage
1.8 / 1.1 / 1.1 V
Temperature
-40 ~ 95 °C
Organization
x32
Product Status
Mass Production
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